Intel EYE810XXVAM Chip Level Teardown Analysis
Overview: This report presents a chip-level teardown analysis of Intel’s EYE810-XXVAM2 Ethernet controller, which powers the E810-XXVDA2 SmartNIC. It is intended for semiconductor professionals, analysts, and engineers seeking insights into the SoC’s internal structure, manufacturing process, and packaging. The report includes optical and X-ray imaging, metal layer and contact analyses, and estimates of the fabrication node. Its purpose is to support competitive benchmarking, technology evaluation, and strategic planning.
Table of Contents:
l Intel E810-XXVDA2 Ethernet Adapter Key Specifications
l EYE810XXVAM Key Specifications
l OM Image Analysis
l X-ray Image Analysis
l Top-view Analysis
l DB-FIB Profile and Metal/CNT Size
l Summary & Implications
Category
Industry
Semiconductors
Service
Individual reports
Report Type
Report
Time Period
Other
Receive our insightful weekly newsletter and stay ahead of the competition.
Author
Brady Wang
Hi, I’m Brady Wang, a seasoned professional with over 20 years of experience in the high-tech industry, spanning semiconductor manufacturing, market intelligence, and strategic advisory roles. Currently, I serve as an analyst at Counterpoint Research, where I specialize in semiconductors with a focus on advanced applications such as automotive, server platforms, and cutting-edge process nodes. My core research centers on AI servers and their key components, including GPUs, custom accelerators, high-bandwidth memory (HBM), CPUs, and advanced packaging technologies. I also track the evolution of AI server architectures, interconnect technologies, and data center deployment trends. By combining deep technical knowledge with market insight, I help clients navigate the fast-changing AI infrastructure landscape and make strategic, data-driven decisions.