Insight

Hot Interconnects: New Form Factors, Fibers and Use Cases for Optics

The technology that was tough to find at Hot Interconnects, a companion conference to Hot Chips that took place August 19-21, was copper. Outside of the occasional mention of copper flyover cables, almost every presentation focused on optics and coming technologies like CPO. But presenters made it clear that, while co-packaged optics (CPO) is imminent, it also won’t be pervasive, at least not the start, as new classes of modules and NPO provide an easier onramp for higher-bandwidth networks.

This report delivers a detailed view of the global handset market by tracking monthly unit and value sales at the OEM, brand, and model levels. It also examines key device specifications, pricing trends, and component adoption across price segments. Covering approximately 99% of the global handset market, the report helps stakeholders understand market movements, technology evolution, and the competitive landscape.