Overview

This report tracks smartphone SoC shipments and revenues at the model level across all major SoC vendors. The scope includes shipment and revenue tracking for key chipset vendors such as Apple, Qualcomm, MediaTek, Huawei, Samsung, and UNISOC, along with ASP analysis for each vendor at the chipset model level. The report covers major chipset models from Q1 2020 to Q1 2026, along with a one-quarter forecast for Q2 2026. It also provides insights into shipments and revenue by price tier and foundry, while highlighting how ASPs are evolving with process node migration and increasing semiconductor content. In addition, the report includes key technical specifications for these chipsets, such as SoC core architecture, foundry relationships, process node, manufacturing technology, modem support, secure element integration, AI accelerator capabilities, GPU configuration, and connectivity technologies.

Table of Contents

• SoC Vendor (Qualcomm, MediaTek, Apple, Hisilicon, UNISOC, Google, Samsung, Xiaomi, JLQ)
• Network (4G, 5G)
• Price Tier (Entry, Mid-low, Mid-high, Premium)
• Foundry Details (like TSMC, Samsung. Etc.)
• CPU Cores Architecture and CPU Cores Count
• Connectivity Tech (4G, 5G)
• Price Tier (Entry, Mid-low, Mid-high, Premium)
• Process Tech (3nm, 4nm, 5nm etc.)
• Foundry Player (TSMC, Samsung, SMIC)
• Manufacturing Tech (N3P, FinFET, N3E, N4, N6, EUV, LPE, 3GAA, etc.)
• Modem (External/Internal)
• Modem Name
• Secure Element Presence
• Security Chip
• AI Accelerator
• GPU Details
• Data Point (Shipments, ASP, Revenue)

Published Date: June 2026