Ian Jenks, Smartkem

Smartkem previously introduced a MicroLED display architecture based on a “chip-first approach” and the fabrication of an organic TFT backplane directly on top of MicroLED chips. Smartkem is still developing this approach in collaboration with ITRI of Taiwan. By using the same dielectric planarization layer and redistribution layer, Smartkem can also make a MicroLED backlight for high-performance LCD. It uses its new MiP4 package that consists of four MicroLED chips (85 μm × 85 μm) connected in series to form a glass-based high-voltage backlight component.

While on stage, Ian Jenks demonstrated a 12.3” backlight panel where each of the 532 zones is controlled with a single MiP4 package. Smartkem believes this is an opportunity to commercialize MicroLED by offering an alternative to existing MiniLED chips. Future implementations could integrate on-chip quantum dot color conversion to make RGB packages.

While on stage, Ian Jenks demonstrated a 12.3” backlight panel where each of the 532 zones is controlled with a single MiP4 package. Smartkem believes this is an opportunity to commercialize MicroLED by offering an alternative to existing MiniLED chips. Future implementations could integrate on-chip quantum dot color conversion to make RGB packages.

David Lewis, InZiv

InZiv has developed an inspection tool that can test the electroluminescence (EL) of all MicroLED chips on a wafer at high throughput. An early-stage inspection provides an opportunity to catch defective chips before mass transfer, thus increasing yields. For MicroLED displays, EL testing is far more indicative of real-world performance than Automated Optical Inspection (AOI) or photoluminescence (PL) testing.

InZiv developed its R-EL Glide tool because standard EL probes are too slow for the production environment, only averaging one LED per second. Moreover, a standard probe can scratch the contact pad of the chip, resulting in irreversible damage. The R-EL Glide uses patented contact probe technology that enables damage-proof testing. It is designed for wafers up to 12” in size and the software gives a clear go/no-go diagnostic to identify which chip to discard.

Simon Jones, Pixel-Flo

Pixel-Flo is a startup that came out of stealth mode for Display Week. The company is working on a new mass transfer technology based on slot-die coating. This means that the tool is defined by the lateral dimension of the substrate instead of the total area. As a result, it should be simple to scale to G6 substrates and beyond.

Pixel-Flo uses a fluidic assembly approach, whereby the MicroLED chips are suspended in solution. During slot-die coating, evaporation of the solvent greatly increases the concentration of MicroLED chips, which in turn increases the chances of trapping the chips on the substrate. Pixel-Flo did not reveal the trap mechanism but brought a sample to demonstrate MicroLED chips arranged in an array after transfer. The company is VC-backed and plans to raise seed funding by next year.

Dr. Guillaume Chansin

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