ENG
Report

CHIPS Act Part II: The National Semiconductor Technology Center and National Advanced Packaging and Manufacturing Program

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July 28, 2023

Overview:

This report examines the role of the National Semiconductor Technology Center and the National Advanced Packaging and Manufacturing Program, both of which were authorized by the Chips Act. The goals, opportunities, and shortcomings of each program are evaluated and further actions are considered.

Table of Contents: 

  • Introduction
    • CHIPS and Science Act
  • National Semiconductor Technology Center
    • What it is
    • Who benefits
  • National Advanced Packaging Manufacturing Program
    • What it is
    • Packaging trends
    • Packaging chokepoints
  • Potential future policies

Number of Pages: 20

Publication Date: July 2023

Category

Industry

N/A

Service

Macro & Geopolitics

Report Type

Report

Time Period

Other

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Author

Matthew Orf