Report

Semicon Taiwan 2025: Silicon Photonics and Co-Packaged Optics Poised to Redefine AI Infrastructure

Overview: This report, presented by Counterpoint Research at the Semicon Taiwan 2025 Silicon Photonics Forum, examines how AI servers and hyperscale data centers are driving the adoption of silicon photonics to overcome bandwidth, power, and thermal bottlenecks. It also highlights the emergence of co-packaged optics (CPO) as a key architecture shaping the future of AI infrastructure

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Brady Wang

Hi, I’m Brady Wang, a seasoned professional with over 20 years of experience in the high-tech industry, spanning semiconductor manufacturing, market intelligence, and strategic advisory roles. Currently, I serve as an analyst at Counterpoint Research, where I specialize in semiconductors with a focus on advanced applications such as automotive, server platforms, and cutting-edge process nodes. My core research centers on AI servers and their key components, including GPUs, custom accelerators, high-bandwidth memory (HBM), CPUs, and advanced packaging technologies. I also track the evolution of AI server architectures, interconnect technologies, and data center deployment trends. By combining deep technical knowledge with market insight, I help clients navigate the fast-changing AI infrastructure landscape and make strategic, data-driven decisions.

Semicon Taiwan 2025: Silicon Photonics and Co-Packaged Optics Poised to Redefine AI Infrastructure

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