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Global Foundry 2.0 Revenue Rises 25% YoY to a Record $96.6 Billion in Q2 2026 as Advanced Packaging Takes Center Stage

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PublishedSeptember 29, 2026
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Author

William Li

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William is a Research Analyst in Semiconductor and Components team, based in Taiwan. He has over 8 years of experience in global PC (personal computer) and semiconductor market. Before Counterpoint, he was an equity research analyst at Credit Suisse, focused on both technology and non-technology sectors as well as supporting Taiwan equity market strategy research. Prior, he worked for a Taiwan PE fund as a research analyst covering semiconductor and downstream components sector.

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Brady Wang

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Hi, I’m Brady Wang, a seasoned professional with over 20 years of experience in the high-tech industry, spanning semiconductor manufacturing, market intelligence, and strategic advisory roles. Currently, I serve as an analyst at Counterpoint Research, where I specialize in semiconductors with a focus on advanced applications such as automotive, server platforms, and cutting-edge process nodes. My core research centers on AI servers and their key components, including GPUs, custom accelerators, high-bandwidth memory (HBM), CPUs, and advanced packaging technologies. I also track the evolution of AI server architectures, interconnect technologies, and data center deployment trends. By combining deep technical knowledge with market insight, I help clients navigate the fast-changing AI infrastructure landscape and make strategic, data-driven decisions.

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Neil Shah

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Neil is a sought-after frequently-quoted Industry Analyst with a wide spectrum of rich multifunctional experience. He is a knowledgeable, adept, and accomplished strategist. In the last 18 years he has offered expert strategic advice that has been highly regarded across different industries especially in telecom. Prior to Counterpoint, Neil worked at Strategy Analytics as a Senior Analyst (Telecom). Neil also had an opportunity to work with Philips Electronics in multiple roles. He is also an IEEE Certified Wireless Professional with a Master of Science (Telecommunications & Business) from the University of Maryland, College Park, USA.

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