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Hybrid Bonding Expands from Logic to Memory: SK Hynix, Applied Materials, BESI Drive Co-optimization to Scale Next-gen HBM
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April 2, 2026

Author

Ashwath Rao

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Ashwath Rao has more than 20 years working experience in industry, research and academics. Ashwath had an opportunity to work with Intel Technology. Ashwath’s major coverage in Counterpoint is semiconductors and component research. Ashwath holds a Doctoral Degree, specializing in Microelectronics from Indian Institute of Information Technology, Master of Science (VLSI) from Manipal University and a Bachelor of Engineering (Electronics & Communication) from Mangaluru University.