Overview

This report tracks smartphone SoC shipments at the model level across all major vendors. The scope includes key chipset vendors such as Apple, Qualcomm, MediaTek, Hisilicon, Samsung, UNISOC, and Google. The analysis covers more than 350 SoC models from Q1 2020 to Q1 2026, along with a one-quarter forecast for Q2 2026. The report provides a detailed view of the SoC market from a shipment perspective and also analyses the market by price tier for each vendor. In addition, the report includes key technical specifications for these chipsets, such as SoC core architecture, foundry relationships, process node, manufacturing technology, modem support, secure element integration, AI accelerator capabilities, GPU configuration, and connectivity technologies.

Table of Contents

• SoC Vendor (Qualcomm, MediaTek, Apple, Hisilicon, UNISOC, Google, Samsung, Xiaomi, JLQ)
• Network (4G, 5G)
• Price Tier (Entry, Mid-low, Mid-high, Premium)
• Foundry Details (like TSMC, Samsung. etc.)
• CPU Cores Architecture and CPU Cores Count
• Connectivity Tech (4G, 5G)
• Price Tier (Entry, Mid-low, Mid-high, Premium)
• Process Tech (3nm, 4nm, 5nm etc.)
• Foundry Player (TSMC, Samsung, SMIC)
• Manufacturing Tech (N3P, FinFET, N3E, N4, N6, EUV, LPE, 3GAA, etc.)
• Modem (External/Internal)
• Modem Name
• Secure Element Presence
• Security Chip
• AI Accelerator
• GPU Details
• Data Point (Shipments)

Published Date: June-2026