Global Automotive NAD Chipset Forecast, Q4 2024
Overview: NAD modules perform similar functions in terms of connectivity as an IoT module except they are configured for automotive-grade applications. This report forecasts the sizing, opportunity, evolution, competitive outlook, and size of the automotive NAD chipset market. The forecasts include shipments, ASP, and revenues of NAD chipset by chipset vendors across different cellular access technologies (2G, 3G, 4G, 5G, 5G RedCap, 6G). We are further splitting 4G technology into 4G Cat 1, 4G Cat 4 and 4G Cat others. The period covered in this report is Q1 2022 to 2030 with eight quarterly and seven yearly forecasts.
Table of Contents:
NAD Chipset Shipments, ASP & Revenue Forecast
- By Chipset Vendor (10+ vendors)
- By Connectivity Technology (5+ connectivity tech)
Published Date: April 2025
Category
Industry
Automotive
Service
Connected Vehicle, Automotive Connectivity
Report Type
Report
Time Period
Quarterly
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Author
Subhadip Roy
Subhadip Roy is a Research Analyst at Counterpoint, specializing in IoT cellular modules, chipsets, NAD modules, Satellite IoT, and IoT applications. With a technical background, Subhadip holds a B-Tech degree in Electrical Engineering from West Bengal University of Engineering. He contributes to research and analysis in the evolving IoT industry, with a focus on technological advancements and market trends.
Parv Sharma
Parv is a Senior Analyst with Counterpoint Technology Market Research based out of Gurgaon, India. He has over 10 years of experience at Counterpoint in market research and strategic consulting across the global technology and telecom sectors. He tracks the global semiconductor ecosystem, with a focus on HPC and data center compute, server CPUs, and AI infrastructure — covering competitive dynamics across Intel, AMD, Arm, Nvidia, and hyperscaler custom silicon. His research also spans the smartphone semiconductor ecosystem — including the Application Processor (AP)/SoC market, foundry, node and manufacturing technology, the RFFE ecosystem and value chain, and smartphone Bill of Materials (BoM) analysis — as well as the Automotive and Connected Car value chain. He leads a team driving data analysis and insights and contributes regularly to media coverage on semiconductors and AI infrastructure.