Global Automotive NAD Module and Chipset Tracker, Q3 2024
Overview:
Network access device (NAD) modules perform similar functions in terms of connectivity as an IoT module except they are configured for automotive-grade applications. This report encompasses the shipment data, revenues, and ASP for NAD modules and chipset models, considering various regions and cellular access technologies such as 2G, 3G, 4G, 5G, NB-IoT, LTE-M, and LPWA-Dual Mode. Additionally, the report includes ASP and revenue details for chipset models categorized by region. Notably, the 4G technology is further dissected into 4G Cat 1 bis, Cat 1, Cat 4, and other categories. The objective is to provide insights into the evolving connectivity landscape within the automotive industry, covering both passenger and commercial vehicles. This comprehensive analysis spans the period from Q1 2022 to Q3 2024, offering a snapshot of the changing dynamics and ecosystem in the automotive connectivity space.
Table of Contents:
NAD Module and Chipset Shipments, ASP & Revenue Tracker
• By Module Vendor (20+ vendors)
• By Chipset Vendor (10+ vendors)
• By Chipset Model (45+ models)
• By Connectivity Technology (5+ connectivity tech)
• By Fallback Technology (7 fallback tech)
• By Price Band (10 price band)
• By Region (8 regions)
Published Date: December 2024
Category
Industry
Automotive
Service
Connected Vehicle, Automotive Connectivity
Report Type
Report
Time Period
Quarterly
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Author
Subhadip Roy
Subhadip Roy is a Research Analyst at Counterpoint, specializing in IoT cellular modules, chipsets, NAD modules, Satellite IoT, and IoT applications. With a technical background, Subhadip holds a B-Tech degree in Electrical Engineering from West Bengal University of Engineering. He contributes to research and analysis in the evolving IoT industry, with a focus on technological advancements and market trends.
Parv Sharma
Parv is a Senior Analyst with Counterpoint Technology Market Research based out of Gurgaon, India. He has over 10 years of experience at Counterpoint in market research and strategic consulting across the global technology and telecom sectors. He tracks the global semiconductor ecosystem, with a focus on HPC and data center compute, server CPUs, and AI infrastructure — covering competitive dynamics across Intel, AMD, Arm, Nvidia, and hyperscaler custom silicon. His research also spans the smartphone semiconductor ecosystem — including the Application Processor (AP)/SoC market, foundry, node and manufacturing technology, the RFFE ecosystem and value chain, and smartphone Bill of Materials (BoM) analysis — as well as the Automotive and Connected Car value chain. He leads a team driving data analysis and insights and contributes regularly to media coverage on semiconductors and AI infrastructure.