Teardown and BoM Analysis for HP OmniBook X 14 (Snapdragon X Elite)
Overview:
The report is an analysis of the teardown and Bill of Materials covering the components that constitute the HP Omni Book X 14 (Snapdragon X Elite). This will help in understanding the cost structure, internal design, suppliers, and components.
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Author
Shenghao Bai
Shenghao Bai is a senior analyst at Counterpoint Research, specializing in Teardown & BoM analysis and smartphone supply chain research. He is also a certified Project Management Professional (PMP). Shenghao has extensive experience working with leading smartphone and smart device companies, including Samsung Electronics, OPPO, and Xiaomi, where he oversaw hardware development and project management across a range of products. His expertise spans product planning and emerging technology trends.
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