FOPLP and Glass Substrate Packaging Market Insights, 2024 Dec

FOPLP and Glass Substrate Packaging Market Insights, 2024 December

Dec 23, 2024

Overview: Artificial intelligence (AI) semiconductors are becoming so complex and large that chip makers and packaging suppliers are turning to glass substrates. This trend could be a major boon to display makers, display equipment suppliers and display materials producers. It is also an ideal solution for under-utilized older a-Si TFT LCD fabs which could be converted or sold for this application. Advantages of glass substrates include superior flatness and better thermal and mechanical stability which will allow for higher density and higher performance chip packages to support AI. Glass substrates enable more transistors to be connected in a single package and also enable the ability to assemble larger configurations of chiplets. Organic materials used in packaging will likely reach their limit by 2030 , they consume more energy than glass and also have expansion and warpage limitations. A growing number of panel, equipment and materials suppliers have already announced programs in glass substrate packaging. TSMC announced CoWoS-R (organic interposer) for AI applications that glass substrate packaging will be adopted will be released in 2027.

Table of Contents:

An Overview of Semiconductor and FOPLP
FOPLP & GSP Market Outlook
Key Technologies and Challenges for FOPLP
Status of Key FOPLP Players
Supply Chain for Key FOPLP Players
FOPLP Market Forecast
Other Advanced Packaging Technologies

Number of Pages: 206

Published Date: Dec 2024

...

Subscription required to
continue reading this content

Please log in to your account or click below to make purchase enquiries for this publication

Existing Subscriber?

go to Login

New to Counterpoint?

go to Register

Author

Leo Liu

Leo Liu joined Counterpoint Research as part of its acquisition of DSCC, where he was Director of Taiwan Operations. Leo has more than 25 years experience in the optoelectronics & semiconductor industry. Leo is a well-known expert in backlighting, LEDs (MiniLED/MicroLED) and advanced semiconductor packaging.