Generative AI (Gen AI) applications require high-speed, high-bandwidth, and low-latency memory to process vast amounts of data in real time. Rapid data access becomes all the more critical when it comes to inference, where real time decision and prediction is required.
Capabilities Needed:
DRAM with the traditional interface has limitations in bandwidth and latency, making technologies like HBM, which stacks DRAM using TSVs, a crucial solution to meet these performance demands. The challenges and solutions related to memory design, and the emerging trends in memory technology are shaping the future of high-performance computing and the competitive landscape.
Going forward, advancements in packaging technologies like 3D-IC and/or CoWoS are going to be adopted across different sectors, such as smartphones or PCs. In smartphones, which have space and cost limitations, various methods will be attempted to reduce latency and energy consumption without increasing cost and space.
It is still unknown what types of Gen AI models and applications will be prevalent in 2030, and how many. Therefore, it will be critical to support the advancement in architecture and build up the ecosystem to be able to respond to any changes.
‘Memory Solutions for Generative AI’ will be published as a comprehensive series of reports covering the following topics:
1) Changing capability
2) Changing competitive dynamics
3) Made in China memory
4) Gen AI in mobile environment.Access full report here.
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