Lenovo ThinkPad X13s Gen1 Teardown Analysis

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Semiconductor-Teardown and BOM

Lenovo ThinkPad X13s Gen1 Teardown Analysis

Jul 15, 2024

This report provides a teardown analysis, from motherboard, key ICs, power supply, and cooling solution perspectives.

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Author

Shenghao Bai

Shenghao Bai is a senior analyst at Counterpoint Research, specializing in Teardown & BoM analysis and smartphone supply chain research. He is also a certified Project Management Professional (PMP). Shenghao has extensive experience working with leading smartphone and smart device companies, including Samsung Electronics, OPPO, and Xiaomi, where he oversaw hardware development and project management across a range of products. His expertise spans product planning and emerging technology trends.