Overview: The report is a Teardown & BoM analysis of Huawei Mate 70 Pro+. The Mate 70 did several updates compared to its predecessor. We did a component-level physical teardown of this model. This report provides the key components marking, suppliers’ information, function-level BoM cost, assumed block diagram, and design analysis of the products. Help readers understand the components’ information, design features, and the impacts to market.
Table of Contents:
- Executive Summary
- Huawei Mate 70 Pro+ Key Specifications and Benchmark Performance
- Huawei Mate 70 Pro+ Teardown Analysis
- Preliminary Analysis
- Analysis of Different Parts
- Block Diagram
- Huawei Mate 70 Pro+ Design Analysis
- Huawei Mate 70 Pro+ BoM Cost Distribution
- Conclusion & Impacts to Market
Existing Subscriber?
Sign in to continue reading
New to Counterpoint?
Register to our service
Category
Contact us
Author
Shenghao Bai
Shenghao Bai is a senior analyst at Counterpoint Research, specializing in Teardown & BoM analysis and smartphone supply chain research. He is also a certified Project Management Professional (PMP). Shenghao has extensive experience working with leading smartphone and smart device companies, including Samsung Electronics, OPPO, and Xiaomi, where he oversaw hardware development and project management across a range of products. His expertise spans product planning and emerging technology trends.
Related Research
Jan 24, 2025
Dec 19, 2024
Sep 26, 2024