BoM Analysis for realme 11 Pro+

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Semiconductor-Teardown and BOM

BoM Analysis for realme 11 Pro+

May 24, 2024

The report is an analysis of the Bill of Materials covering the components that constitute the realme 11 Pro+.

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Author

Shenghao Bai

Shenghao Bai is a senior analyst at Counterpoint Research, specializing in Teardown & BoM analysis and smartphone supply chain research. He is also a certified Project Management Professional (PMP). Shenghao has extensive experience working with leading smartphone and smart device companies, including Samsung Electronics, OPPO, and Xiaomi, where he oversaw hardware development and project management across a range of products. His expertise spans product planning and emerging technology trends.