In the era of on-device AI, the demand for 3D NAND Flash is surging. But as the industry prepares to scale beyond 400 layers, and go to 1,000 layers over the next decade, it introduces a set of challenges for chipmakers. Leading semiconductor equipment maker Lam Research has innovative solutions to help chipmakers with etch and deposition technologies. In the latest Counterpoint Conversations episode, our VP of Research, Neil Shah, had an insightful conversation with Harmeet Singh, Group VP & GM of Etch, Lam Research. Singh shed light on how the industry is pushing the envelope of memory density and performance.

The Interview

Key Takeaways from the Discussion

Lam Research's Role in the Industry

• Lam Research provides semiconductor manufacturers with equipment for etching and deposition.
• Almost all leading chip makers are Lam Research customers.
• Lam Research is closely working with all its customers, from logic, HBM, DRAM, to NAND makers, enabling them to produce next-gen processing, memory and storage chips for AI applications.

NAND Flash – Crucial in Enabling on-device AI

• As AI use cases expand, the inferencing will move from cloud to edge, and autonomous cars, for instance, will need 10x more SSD storage compared to what it needs currently.
• The high storage capacity and solid-state nature of NAND flash make it a crucial component for AI-enabled devices including smartphones, laptops, and autonomous cars.
• Low energy consumption, performance, and reliability make it ideal for AI applications.
• Lam Research’s 3D NAND technology is at the forefront, which increases both capacity and density.

Scaling 3D NAND to 1,000 Layers

• NAND technology has evolved from 2D to 3D by stacking layers to increase capacity.
• The industry is aiming to reach 1,000 layers by 2030, but etching deep, narrow holes is one of the major challenges.
• Lam Research is addressing these challenges with new and innovative chemistries, temperature regimes, and scaling products with higher energy.

Scaling Vectors for 3D NAND

• Besides vertical scaling, there are two additional vectors: logical scaling and lateral scaling.
• Logical scaling refers to the number of bits stored in a memory cell.
• Lateral scaling means fitting more memory cells in each layer by reducing the distance between them.
• Together with vertical scaling, the scaling vectors contribute to increased capacity and density.

Technological Advancements: Cryogenic Etching

• Cryogenic etching technology was introduced back in 2019 with the Flex H-series product to improve the overall etching process for 3D NAND devices.
• Currently, in third-generation Cryo 3.0, the latest Vantex C-series can produce exciting results paving the way towards 1,000 layers.
• Cryogenic etching offers several benefits including higher etching rates and reduced cost.
• However, operating at lower temperatures presents some unique challenges too.
• Lam Research has processed over five million wafers on cryogenic etching and has a total install base of nearly 7,500 chambers including traditional etches with almost 1,000 chambers doing cryogenic etching.

Using AI in Manufacturing

• With the challenges of processes increasing exponentially, Lam Research is using AI to analyze the large amount of data that is generated in the manufacturing process.
• The AI data, along with machine learning, is helping Lam Research accelerate the development of its next-generation processes.
• Singh also mentioned that Lam research will be using more AI and modeling to enable new solutions.

Sustainability in Manufacturing

• Sustainability is a growing concern and Lam Research is committed to achieving significant sustainability targets.
• It uses pulse plasmas and other techniques to reduce power consumption.
• The new Cryo 3.0 chemistries have done away with fluorocarbons which has significantly helped in reducing emissions and reduced energy consumption by 40% compared to previous nodes.

Analyst Takeaways

• Delivering the required tools and solutions in etch technology to address the manufacturing challenges becomes significant as the complexity increases with the 3D NAND stack growing taller with each successive generation.
• Unlike previous NAND technologies which focused on process efficiencies and materials, innovation will help optimize manufacturing processes, resulting in better performance, increased yield, and reduced costs enabling 3D NAND FLASH roadmap extension to the next decade.
• The latest innovation “Lam CryoTM 3.0” from Lam Research will help OEMs accelerate the pace of development in 3D NAND FLASH and meet increased capacity and bit growth requirements due to AI proliferation across end markets.
• The new process involving low temperature coupled with lean chemistry offers an additional window of improvement to NAND manufacturers as it paves the way for better hole shape control, unlike conventional processes. Innovations with such precision and uniformity, along with delivering lower environmental impact, are needed to overcome the AI era’s key manufacturing hurdles, especially when employed in high-volume production.