Overview

This report tracks smartphone SoC shipments for the top 20 best-selling chipset models globally. It includes historical data from Q1 2019 to Q1 2026, providing insights into the shipment performance of the leading SoC models in the market. In addition, the report covers key technical specifications for these chipsets, including SoC core architecture, manufacturing technology, foundry relationship, process node, and die size. This analysis helps provide a deeper understanding of the most widely adopted SoC models from a shipment perspective.

Table of Contents

  • CPU Cores Architecture and CPU Cores Count
  • Connectivity Tech (4G, 5G)
  • Process Tech (3nm, 4nm, 5nm etc.)
  • Foundry Player (TSMC, Samsung, SMIC)
  • Manufacturing Tech (N3P, FinFET, N3E, N4, N6, EUV, LPE, 3GAA, etc.)
  • Die Size
  • Data Point (Shipments and ASP)