ENG
Overview:
The report is an analysis of the Bill of Materials covering the components that constitute the Samsung Galaxy Z Flip5. This will help in understanding the cost structure and components.
Industry:
Semiconductors
Service:
Teardown and BoM
Report Type:
Report
Time Period:
Other
Industry:
Semiconductors
Report Type:
Report
Service:
Teardown and BoM
Time Period:
Other
Ethan Qi
Ethan is an associate director in Counterpoint‘s Greater China team, dedicated to research of smart device, semicondutor and BoM analysis, AI Robotics Research, and emerging technologies. Ethan has been working in the handset and semiconductor industry for 10+ years. Prior to joining Counterpoint Research, Ethan served Coolpad, VIA and Intel sequentially as senior technology researcher and product manager respectively.
Shenghao Bai
Shenghao Bai is a senior analyst at Counterpoint Research, specializing in Teardown & BoM analysis and smartphone supply chain research. He is also a certified Project Management Professional (PMP). Shenghao has extensive experience working with leading smartphone and smart device companies, including Samsung Electronics, OPPO, and Xiaomi, where he oversaw hardware development and project management across a range of products. His expertise spans product planning and emerging technology trends.
