The global Fan-Out Panel-Level Packaging (FOPLP) and Glass Substrate Packaging (GSP) market is expected to experience significant growth over the coming years as semiconductor companies develop advanced packaging technologies to support increasingly complex AI and high-performance computing (HPC) workloads.

According to Counterpoint Research’s latest 2026 FOPLP and Glass Substrate Report, the combined FOPLP and glass substrate market is forecast to grow from approximately $650 million in 2024 to more than $8.1 billion by 2030.

AI and HPC applications are expected to be the largest contributors to market growth, accounting for 45.6% of total FOPLP market revenue by 2030. The increasing adoption of AI accelerators and advanced computing processors is driving demand for packaging solutions that offer higher interconnect density, improved thermal performance and larger package sizes.

“As package complexity continues to increase, glass substrates are gaining industry attention as a potential alternative to traditional organic substrates,” said Yoshio Tamura, Vice President of Research at Counterpoint Research. “Compared with organic materials, glass substrates offer advantages in interconnect density, dimensional stability and warpage control, supporting the development of next-generation chiplet-based architectures and large AI processors.”

The report details how major semiconductor ecosystem participants are investing in related technologies and manufacturing capacity. TSMC is developing its CoPoS (Chip-on-Panel-on-Substrate) platform, while Intel, Samsung Electro-Mechanics, ASE and PTI are expanding their respective glass substrate and panel-level packaging initiatives to address future market requirements.

 FOPLP Panel Capacity by Region Forecast, 2024-2030F

From a regional perspective, East Asia is expected to remain the primary manufacturing hub for panel-level packaging. Counterpoint Research forecasts Taiwan, Japan and Mainland China will account for 84.8% of global panel-level packaging capacity by 2030. Among these markets, Japan is expected to record particularly strong capacity growth as investment in glass substrate production increases.

While the market outlook remains positive, technical challenges such as panel size standardization, Through-Glass Via (TGV) process consistency and manufacturing scalability will continue to influence the pace of commercialization. Ongoing ecosystem collaboration and technology development are expected to support broader adoption throughout the forecast period.

About Counterpoint Research 

Counterpoint Research is a global market research firm specializing in products across the technology ecosystem. We advise a diverse range of clients – from smartphone OEMs to chipmakers and channel players to Big Tech – through our offices located in the world's major innovation hubs, manufacturing clusters and commercial centers. Our analyst team, led by seasoned experts, engages with stakeholders across the enterprise – from the C-suite to professionals in strategy, analyst relations (AR), market intelligence (MI), business intelligence (BI), product and marketing – to deliver services spanning market data, industry thought leadership and consulting. Our core areas of coverage include AI, Automotive, Consumer Electronics, Displays, eSIM, IoT, Location Platforms, Macroeconomics, Manufacturing, Networks and Infrastructure, Semiconductors, Smartphones and Wearables. Visit our Insights page to explore our publicly available market data, insights and thought leadership, and to understand our focus, meet our analysts and start a conversation. 

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