Overview:
This report provides a snapshot of Computex Taipei 2024, where Nvidia’s GB200 set the stage for the event. We have also highlighted key players in the downstream supply chain essential for the next generation of AI, including thermal producers, Baseboard Management Controllers, and AI PC OEMs/ODMs.
Table of Contents:
- Overview
- Key Finding
- Booth Review: Chipmakers, Thermal Solutions, Baseboard Management Controller, Memory Provider, AI PC OEMs/ODMs and Networking
Number of Pages: 20
Published Date: June 2024
Overview:
This comprehensive study delves into the intricate details of the semiconductor manufacturing industry, specifically focusing on the major foundry capacity, wafer pricing, and utilization rates for processes at 28nm and below. It also provides the share of major smartphone AP vendors in the primary foundry node. Understanding these critical metrics is paramount for making decisions in this dynamic market, as the semiconductor landscape continues to evolve rapidly.
Table of Contents:
- Foundry Capacity by Linewidth Tracker (28nm and below)
- Foundry Wafer Price by Linewidth Tracker (28nm and below)
- Foundry Utilization Rate by Linewidth Tracker
- Global Foundry sales/market share tracker
- Contacts
Published Date: June 2024
Overview:
This report offers a detailed analysis of the key information gleaned from COMPUTEX Taipei 2024. It delves into the major announcements from industry giants like NVIDIA, AMD, Intel, and Qualcomm, with a particular focus on the overarching theme of “Connecting AI.” The report summarizes the latest advancements in AI technology, the renewed focus on GenAI PCs, and the collaborations shaping the industry’s future.
Table of Contents:
- Computex Taipei 2024 Introduction
- Accelerating AI and GPU Innovations – NVIDIA
- AI Breakthroughs in Data Centers, Edge, and Devices – AMD
- Unprecedented Turning Point in the PC Industry – Qualcomm
- Next-generation Solutions and Open Ecosystem Integration – Intel
- Enabling AI from Cloud to Edge – Arm
- The Era of Smart Connected Robots is Here – NXP
- Advancing Semiconductor Tech and Connectivity for Ubiquitous AI – MediaTek
- Next-gen BMC Targets Modular Servers – Aspeed
- Advanced AI and Green Computing for Optimized IT Solutions – Supermicro
- India’s Initiatives for Becoming a Leading EV Manufacturing Hub – TCS
- Renesas Leveraging its Product Portfolio in the EV Era – Renesas
Number of Pages: 18
Published Date: June 2024
Overview:
The report provides insights on global wafer fab equipment manufacturers’ revenue, performance in 2023 and Q1 2024, and forecast for full year 2024.
Table of Contents:
- Executive Summary
- Q1 2024 Performance Highlights
- Forecast and 2024 Outlook
- WFE 2023 Performance
- Key Takeaways
Number of Pages: 26
Published Date: June 2024
Overview:
This report tracks smartphone AP/SoC shipments from all key vendors such as Apple, Qualcomm, MediaTek, Huawei, Samsung, UNISOC, and JLQ. The report covers smartphone AP/SoC shipment view by region, smartphone OEMs, price bands, inventory, and ASPs. It also includes the full-year forecast for 2024 and key highlights of the smartphone chipset industry in Q1 2024. This report will help you understand the AP/SoC market from a shipment perspective.
Table of Contents:
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- Smartphone Chipset Competition: Q1 2024 Update
- Smartphone Chipset By Price Band Analysis
- Smartphone Chipset Forecast
- Inventory Analysis
- Highlights- Q1 2024
Number of Pages: 27
Overview:
This report tracks the smartphone AP/SoC Shipments by process nodes. We cover historical data starting from Q1 2023 to Q4 2023. This report also include full year chipset shipment forecast by nodes and by quarters for 2024E. This report will help you to understand the smartphone chipset shipment from the nodes perspective. Furthermore, we have also covered key specs for these AP/SoC covering market view by:
- Chipset Vendors (like Qualcomm, MediaTek, Apple, etc.)
- Process node (3nm, 5/4nm, 6nm, 8nm, etc.)
Table of Contents:
- Global Smartphone AP/SoC Shipment by nodes 2023 and 2024E
Summary:
- 5/4nm is going to be another long-term node.
- In LTE we are seeing migration from 8nm and above nodes to 6/7nm process nodes.
- In entry-level LTE 28/11/12 nm, will continue to be the preferred nodes.
- Apple remains the major customer on a 3nm-based chipset from 2H 2023. However, 3nm wafer demand will ramp up from 2024.
Published Date: June 2024
Overview:
This report tracks the smartphone AP/SoC Shipment forecast for full-year 2024E. We cover historical data starting from Q1 2022 to Q4 2023. This report also includes full-year chipset shipment forecast by chipset vendors (like Qualcomm, MediaTek, Apple, UNISOC, Google, Samsung, Huawei and JLQ) and by quarters for full year 2024E and Q1 2025E. This report will help you to understand the smartphone chipset shipment market trends in 2024.
Table of Contents:
- Global Smartphone AP/SoC Shipment Full Year forecast by Chipset vendors Q1 2022-Q1 2025E
Summary:
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- After two years of significant declines, the smartphone semiconductor market is likely to turn the corner, with 2024 smartphone AP-SoC shipments rebounding 9% YoY.
- Recovery in the low and mid-market and continued momentum in the premium segment will drive volume in 2024.
- 5/4nm is going to be another long-term node; transition from the 6/7nm node, particularly in entry-level 5G chipsets.
- TSMC remains untouchable at advance nodes; SMIC will gain some share due to Huawei, however capacity expansion remains challenging due to the current geopolitical situation.
Published Date: June 2024
Overview:
This report tracks smartphone AP/SoC sales by all chipset vendors and by top smartphone OEMs (Samsung, OPPO, vivo, Xiaomi, HONOR, Lenovo, Transsion and Huawei). We cover historical data starting from Q1 2019 to Q1 2024. This report will help you to analyze smartphone sales by the network (5G and LTE) and by top smartphone OEMs.
Table of Contents:
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- Qualcomm AP/SoC Sales by Top Smartphone OEMs Q1 2019- Q1 2024
- MediaTek AP/SoC Sales by Top Smartphone OEMs Q1 2019- Q1 2024
- Samsung AP/SoC Sales by Top Smartphone OEMs Q1 2019- Q1 2024
- UNISOC AP/SoC Sales by Top Smartphone OEMs Q1 2019- Q1 2024
- Google AP/SoC Sales by Top Smartphone OEMs Q1 2019- Q1 2024
- Huawei AP/SoC Sales by Top Smartphone OEMs Q1 2019- Q1 2024
Published Date: June 2024
Overview:
This report tracks the smartphone AP/SoC Shipments by top 20 selling chipset models. We also cover historical data starting from Q1 2019 to Q1 2024. This report will help you to understand the Top selling AP/SoC models from the shipment perspective. Furthermore, we have also covered key specs for these AP/SoC covering market view by:
- Foundry Details (like TSMC, Samsung. etc.)
- Process node (5nm, 6nm, 8nm, etc.)
- Manufacturing Process (FinFET, N7, N5, etc.)
- CPU Cores Architecture and CPU Cores Count
- ASP
- Die Size
Table of Contents:
- Global Smartphone AP/SoC Shipment by 20 Top selling Chipset Models Q1 2019-Q1 2024
- Global Smartphone AP/SoC Shipment by Chipset Brands Q1 2019-Q1 2024
Summary:
Apple: Apple shipments declined in Q1 2024 due to seasonality.
MediaTek: MediaTek shipments decline QoQ in Q1 2024 after a strong restocking demand in Q4 2023. LTE SoC shipments saw a major drop in Q1 2024.
Qualcomm: Qualcomm’s shipments declined sequentially in Q1 2024 due to the slowing momentum of the Snapdragon 800 series because of seasonality.
Samsung: Samsung shipments increased QoQ in Q1 2024 due to the launch of Exynos 2400 with Samsung Galaxy S24. The Samsung Galaxy A25 series with Exynos 1280 has also added volumes to the overall Samsung chipset segments.
UNISOC: UNISOC’s shipments have declined sequentially in Q1 2024. UNISOC continues to gain a share in the low-tier bands (under $99) driven by its LTE portfolio.
Published Date: June 2024
