Tenstorrent at The Open Frontier: RISC-V Everywhere
Tenstorrent positions itself as a full-stack AI company that spans IP, silicon, systems, software and cloud. It licenses both CPU and AI IP.
16. Okt. 2026
DEU
Unsere End-to-End-Abdeckung des Tech-Ökosystems – von der Foundry bis zu Endgeräten – ermöglicht es uns, umfassende und tiefgehende Forschung zu den zugrunde liegenden Technologien und Trends zu liefern, die Halbleiter und Komponenten antreiben.
Kernfunktionen Foundry
Kernfunktionen
Foundry
Was ist enthalten?
Supply Analysis
Größere Foundry-Kapazitätserweiterungen nach Fabs, Auslastungsprognosen, Wafer-Preistrends und Entwicklungen bei Advanced-Node-Technologien.
Demand Analysis
Wafer-Nachfragetrends und Forecast über zentrale Technologien, Endanwendungen und Hauptkunden. Inklusive AP SoC, AI GPU, AI ASIC, PC CPU/GPU, WiFi, XR, TWS, Smartwatch, ADAS usw.
Monthly Intelligence Report
Liefert Echtzeit-Marktintelligenz mit Fokus auf Markttrends und Hot-Topic-Analysen, einschließlich Foundry-UT-Rate, Kapazitätserweiterungen, Wafer-Preistrends, Advanced-Packaging-Entwicklungen und Marktnachfrageprognosen.
Tenstorrent positions itself as a full-stack AI company that spans IP, silicon, systems, software and cloud. It licenses both CPU and AI IP.
16. Okt. 2026
1. Overview Memory prices are still rising across every segment in Q4 2026. AI inference demand and CSP stockpiling are pushing server DRAM and NAND higher. Smartphone OEMs are turning to recycled memory ICs to cut costs. PC makers face much steeper increases, and they are coping by capping specs, raising ASPs, and keeping products on the market longer.
16. Okt. 2026

Tenstorrent positions itself as a full-stack AI company that spans IP, silicon, systems, software and cloud. It licenses both CPU and AI IP.
16. Okt. 2026
1. Overview Memory prices are still rising across every segment in Q4 2026. AI inference demand and CSP stockpiling are pushing server DRAM and NAND higher. Smartphone OEMs are turning to recycled memory ICs to cut costs. PC makers face much steeper increases, and they are coping by capping specs, raising ASPs, and keeping products on the market longer.
16. Okt. 2026
16. Okt. 2026
14. Okt. 2026
12. Okt. 2026
9. Okt. 2026
9. Okt. 2026
29. Sept. 2026

Vice President of Research
Neil Shah

Vice President of Research
Neil Shah

Research Director
MS Hwang

Research Director
MS Hwang

Associate Director
Ethan Qi

Associate Director
Ethan Qi

Associate Director
Brady Wang

Associate Director
Brady Wang

Associate Director
Gunnar Thoreson

Associate Director
Gunnar Thoreson

Senior Analyst
Parv Sharma

Senior Analyst
Parv Sharma

Senior Analyst
Shenghao Bai

Senior Analyst
Shenghao Bai

Senior Analyst
Anish Khajuria

Senior Analyst
Anish Khajuria

Senior Analyst
Shivani Parashar

Senior Analyst
Shivani Parashar

Principal Analyst
Soumen Mandal

Principal Analyst
Soumen Mandal

Senior Analyst
William Li

Senior Analyst
William Li

Principal Analyst at Large
Michael Kanellos

Principal Analyst at Large
Michael Kanellos

Vice President of Research
Neil Shah

Vice President of Research
Neil Shah

Research Director
MS Hwang

Research Director
MS Hwang

Associate Director
Ethan Qi

Associate Director
Ethan Qi

Associate Director
Brady Wang

Associate Director
Brady Wang

Associate Director
Gunnar Thoreson

Associate Director
Gunnar Thoreson

Senior Analyst
Parv Sharma

Senior Analyst
Parv Sharma

Senior Analyst
Shenghao Bai

Senior Analyst
Shenghao Bai

Senior Analyst
Anish Khajuria

Senior Analyst
Anish Khajuria

Senior Analyst
Shivani Parashar

Senior Analyst
Shivani Parashar

Principal Analyst
Soumen Mandal

Principal Analyst
Soumen Mandal

Senior Analyst
William Li

Senior Analyst
William Li

Principal Analyst at Large
Michael Kanellos

Principal Analyst at Large
Michael Kanellos