One real product announcement: the TSMC ADK, an AI Design Kit that replaces the human-facing PDK with agents trained on TSMC's own design history. The rest of the event was about roadmap and partner certification.

2026年9月28日

Overview At its 2026 North America OIP Ecosystem Forum in Santa Clara, TSMC argued that process, package, optics and the design flow now ship as one product. This is the fifth report in the Trillion-Dollar Bottleneck series. It decodes what TSMC actually announced, from the AI Design Kit (ADK) to a packaging roadmap running to 2029 and 3D DRAM appearing on that roadmap. It also assesses what the bundling strategy means for TSMC's lead in the angstrom era.

2026年9月28日