Overview:

Mobile DRAM prices are expected to rise by about 10% QoQ in Q3 2026, with the price gap among suppliers continuing to narrow. As of Q2 2026, this surge in memory prices drove up the BoM cost of low-end smartphones by 70% YoY, causing lineup reductions, while in premium smartphones, DRAM dethroned the SoC to become the most expensive component.

To overcome memory shortages, the CSP trend of splitting server DRAM allocations is expanding into the HBM sector. NVIDIA is taking a pragmatic route by adopting an 8-hi HBM4 derivative version instead of the 12-hi HBM4 for Rubin, securing 1.5 times more Cube volume while maintaining bandwidth and reducing heat. As the quantity of HBM cubes increases, TSMC and Samsung Electronics’ Foundry Business unit, which supply the base dies, are expected to benefit.

As Big Tech and CSP companies continue their data center investments, AI memory demand remains strong. Despite the physical limits of cleanrooms, suppliers are making allout efforts to increase production while aiming for technological leadership. With Samsung Electronics claiming an expansion in its HBM market share and SK hynix aiming to maintain its HBM dominance, HBM is projected to serve as a key pillar of memory revenue next year.

Table of Contents:

• Another DRAM price increase in Q3 2026
• HBM adopts allocation-splitting trend
• HBM dominance race

Number of Pages : 5

Published Date: August 7 2026