Overview:
The report provides a comprehensive analysis of the semiconductor industry’s wafer capacity distribution across different process nodes. The report examines the quarterly capacity for both advanced and matured nodes, highlighting the shifts and trends that are reshaping the foundry landscape. It offers insights into the technological capabilities and strategic plans of key players, with a particular focus on TSMC’s collaboration with ASML in implementing EUV (Extreme Ultraviolet) lithography.
Table of Contents:
- Quarterly Capacity – Advanced
- Quarterly Capacity – Matured
- TSMC/ASML EUV Plan
Published Date: June 2024