BoM Analysis for Honor Magic V and Vs

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Feb 10, 2023

Overview:

The report is an extended analysis of the Bill of Materials covering the components that constitute Honor Foldable smartphones. This will help in understanding the cost structure and the Components.

Table of Contents:

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Category

Industry

Semiconductors

Report Type

Report

Summary

Published

Feb 10, 2023

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Author

Ethan Qi

Ethan is an associate director in Counterpoint's Greater China team, dedicated to research of smart device, semicondutor and BoM analysis, and emerging technologies. Ethan has been working in the handset and semiconductor industry for 10+ years. Prior to joining Counterpoint Research, Ethan served Coolpad, VIA and Intel sequentially as senior technology researcher and product manager respectively.

Shenghao Bai

Shenghao Bai is a senior analyst at Counterpoint Research, specializing in Teardown & BoM analysis and smartphone supply chain research. He is also a certified Project Management Professional (PMP). Shenghao has extensive experience working with leading smartphone and smart device companies, including Samsung Electronics, OPPO, and Xiaomi, where he oversaw hardware development and project management across a range of products. His expertise spans product planning and emerging technology trends.

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