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BoM Analysis for Honor Magic V and Vs
Overview:
The report is an extended analysis of the Bill of Materials covering the components that constitute Honor Foldable smartphones. This will help in understanding the cost structure and the Components.
Table of Contents:
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Category
Industry
Semiconductors & Other Components
Report Type
Report
Summary
Published
Feb 10, 2023
Author
Ethan Qi
Senior Analyst Ethan is a Senior Analyst with Counterpoint Mobile and Semiconductors, dedicated to IoT, the wearable, Integrated Circuits and emerging technologies. Ethan had been working in the mobile phone and semiconductor industry for 10+ years. Prior to joining Counterpoint Research, Ethan served Coolpad, VIA and Intel sequentially as senior technology researcher and product manager respectively.
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