Scaling to 1,000-Layer 3D NAND in the AI Era
PDF | 17 pages
Published date: August 2024
Overview
As the demand for 3D NAND Flash surges, the industry is preparing for a leap to 1,000 word-line layers over the next decade, potentially achieving die densities of 100 Gbit/mm². However, scaling beyond 400 layers introduces significant challenges, such as slow etch rates and vertical profile variability, which demand continuous innovation in etch and deposition technologies.
This whitepaper, authored by Counterpoint Research in partnership with Lam Research, delves into how Lam’s innovations in etching technologies, including their cryogenic dielectric etch technology, are crucial for overcoming these challenges. Lam’s innovations enable better control of high aspect ratio etches, essential for vertical scaling, while also reducing the environmental impact of the etching process.
For those interested in the future of 3D NAND and the technologies driving its growth, this whitepaper offers valuable insights into how the industry is pushing the boundaries of memory density and performance.
To learn more submit the form to receive full whitepaper.
Table of Contents
- Executive Summary
- The 3D NAND Revolution
- The Future Scaling of 3D NAND: Challenges
- The Future Scaling of 3D NAND: Solutions
- The Future Scaling of 3D NAND: Enabling Roadmap for AI Era
- Key Takeaways
Read more about Lam Cryo™ 3.0 Cryogenic Etch Technology announcement and details by
LEAD AUTHORS
Neil Shah
Vice President of Research
Ashwath Rao
Senior Analyst
PARTNER
lamresearch.com
Author
Team Counterpoint
Counterpoint Research is a global industry and market research firm providing market data, intelligence, thought leadership and consulting across the technology ecosystem. We advise a diverse range of global clients spanning the supply chain – from chipmakers, component suppliers, manufacturers and software and application developers to service providers, channel players and investors. Our veteran team of analysts serve these clients through our offices located across the key innovation hubs, manufacturing clusters and commercial centers globally. Our analysts consistently engage with C-suite through to strategy, market intelligence, supply chain, R&D, product management, marketing, sales and others across the organization. Counterpoint’s key coverage areas: AI, Automotive, Cloud, Connectivity, Consumer Electronics, Displays, eSIM, IoT, Location Platforms, Macroeconomics, Manufacturing, Networks & Infra, Semiconductors, Smartphones and Wearables.
