In the era of on-device AI, smartphones are transforming into powerful edge computing devices. This shift demands a significant leap in storage and high-speed transfer capabilities to handle the increasing demands of these complex AI models. Micron, a leading memory and storage innovator, is spearheading this exciting frontier.
At MWC 2024, Counterpoint’s VP of Research, Neil Shah, sat down with Micron's VP of Marketing, Christopher Moore, to delve deeper into how the company’s cutting-edge technology is paving the way for the first wave of generative AI-powered smartphones.
• Ultra-fast transfer speeds (over 4 gigabytes per second).
• Tiny footprint, 9x13 millimeters (mm), allowing for a slimmer smartphone design.
• HONOR and Samsung pushing the boundaries of AI integration.
• The HONOR Magic 6 Pro supports features like intent-based AI, where the phone intelligently interprets user actions.
• One-button refresh – to defragment storage for sequential read for improved performance.
• High-Performance Mode (HPM) – to optimize phone performance by automatically prioritizing app loading.
• Developing energy-efficient solutions, measured in "tops per watt," to maximize battery life in AI-powered devices.
• Advanced “Logic” semiconductors (CPU/NPU/GPU) are essential foundation blocks integrating billions of transistors and smart software to enable the computation of billions of parameters enabling generative AI at the edge. Meanwhile, equally advanced “memory” semiconductors in the form of LPDDR5X DRAM and UFS 4.0 NAND storage, completes the overall computational foundation capabilities at the edge.
• It is quite impressive to see Micron’s marquee design win powering GenAI smartphones with its cutting-edge memory solutions and smart firmware driving performance and power efficiencies for such computational heavy tasks in battery-powered edge devices.
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