Global Top 20 Smartphone SoC Model Shipments Tracker, Q1 2026
Overview
This report tracks smartphone SoC shipments for the top 20 best-selling chipset models globally. It includes historical data from Q1 2019 to Q1 2026, providing insights into the shipment performance of the leading SoC models in the market. In addition, the report covers key technical specifications for these chipsets, including SoC core architecture, manufacturing technology, foundry relationship, process node, and die size. This analysis helps provide a deeper understanding of the most widely adopted SoC models from a shipment perspective.
Table of Contents
- CPU Cores Architecture and CPU Cores Count
- Connectivity Tech (4G, 5G)
- Process Tech (3nm, 4nm, 5nm etc.)
- Foundry Player (TSMC, Samsung, SMIC)
- Manufacturing Tech (N3P, FinFET, N3E, N4, N6, EUV, LPE, 3GAA, etc.)
- Die Size
- Data Point (Shipments and ASP)
Published Date: June, 2026
Category
Industry
Semiconductors
Service
Smartphone SoC
Report Type
Report
Time Period
Quarterly
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Author
Akash Jatwala
Akash Jatwala is a Research Analyst at Counterpoint, specializing in Smartphone AP/SoC, Smart TVs, and 5G Networks Infrastructure. With a PGDM in Finance from IMT Nagpur, and a B.Com from Calcutta University, Akash brings over 5 years of experience in analyzing technological advancements and market trends within the device ecosystem.