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Semiconductors

我们覆盖从晶圆代工到终端设备的完整科技产业链，围绕驱动半导体及零部件发展的底层技术与市场趋势，提供深入的研究与分析。

"Semiconductors" Data and Research

核心特点 Foundry

  • 按季度提供数据及近实时市场洞察，涵盖供需动态，并提供未来五年的市场预测
  • 供给侧： 分析全球晶圆代工市场格局，涵盖主要厂商的晶圆代工产能、产能利用率及制程节点转换情况
  • 需求侧： 分析 15 个以上主要终端应用领域的晶圆需求，包括智能手机、服务器、PC、汽车及网络通信等领域

服务内容

供给分析

分析主要晶圆代工厂的产能扩张计划、产能利用率预测、晶圆价格趋势及先进制程技术发展。

需求分析

分析并预测主要技术、终端应用及主要客户的晶圆需求趋势，涵盖 AP SoC、AI GPU、AI ASIC、PC CPU/GPU、Wi-Fi、XR、TWS、智能手表、ADAS 等。

月度行业动态报告

提供近实时的市场情报内容，重点关注市场趋势及热点议题分析，包括晶圆代工厂产能利用率（UT Rate）、产能扩张、晶圆价格趋势、先进封装技术发展及市场需求预测等。

Latest Research

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Mobile Memory Cost Hikes: Industry Trends and OnePlus’ Strategic Response

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2026年9月29日

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Global Foundry 2.0 Revenue Rises 25% YoY to a Record $96.6 Billion in Q2 2026 as Advanced Packaging Takes Center Stage

The global Foundry 2.0 market’s revenue grew 25% YoY to a record $96.6 billion in Q2 2026, accelerating from 24% in Q1 2026, driven by AI GPUs, custom AI ASICs and the broader AI infrastructure build-out, including server CPUs, networking chips and power management ICs.

2026年9月29日

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意见领袖

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Vice President of Research

Neil Shah

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MS Hwang

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Ethan Qi

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Brady Wang

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Gunnar Thoreson

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Parv Sharma

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Senior Analyst

Shenghao Bai

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Senior Analyst

Anish Khajuria

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Shivani Parashar

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Principal Analyst

Soumen Mandal

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Senior Analyst

William Li

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Principal Analyst at Large

Michael Kanellos

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