中文
行业:
Semiconductors
服务:
Teardown and BoM
报告类型:
Report
时间段:
Other
行业:
Semiconductors
报告类型:
Report
服务:
Teardown and BoM
时间段:
Other
Overview:
The report is an analysis of the Bill of Materials covering the components that constitute the HP Omni Book X 14 (Snapdragon X Elite). This will help in understanding the cost structure and components.
Shenghao Bai
Shenghao Bai is a senior analyst at Counterpoint Research, specializing in Teardown & BoM analysis and smartphone supply chain research. He is also a certified Project Management Professional (PMP). Shenghao has extensive experience working with leading smartphone and smart device companies, including Samsung Electronics, OPPO, and Xiaomi, where he oversaw hardware development and project management across a range of products. His expertise spans product planning and emerging technology trends.
