- Memory makers are actively pursuing hybrid bonding tools as a key differentiator, with SK Hynix signaling the shift toward production-scale adoption.
- SK Hynix’s tool procurement signals a shift toward scaling hybrid bonding for high-volume HBM manufacturing.
- Integrated solutions from Applied Materials and BE Semiconductor Industries to reduce process complexity and address key CMP-driven challenges.
- Hybrid bonding, the key technology to reach fine pitch and high-density stacking in heterogeneous integration.
HBM: Backbone of AI and HPC
High Bandwidth Memory (HBM) has become a critical enabler for AI and high-performance computing (HPC), delivering the bandwidth and efficiency required for data-intensive workloads like large language models. HBM typically stacks 12-16 DRAM dies on a base logic die and is integrated alongside GPUs. Currently, these stacks rely on micro-bump interconnects using methods such as mass reflow with moulded underfill (MR-MUF) or thermal compression bonding with non-conductive film (TC-NCF).
