Thales, G+D, ST Micro Lead eSIM Enablement Landscape
Seoul, Hong Kong, New Delhi, Beijing, London, Buenos Aires, San Diego - December 16, 2020
More than 6 billion eSIM (eUICC- and iUICC-based) capable devices will be shipped cumulatively over the next five years, according to the latest research from Counterpoint’s ETO (Emerging Technology Opportunities) Service. The uptake of eSIMs is poised to grow across a gamut of connected devices over the next decade, led by the flexibility, cost efficiency, security and other myriad benefits offered by the technology. Commenting on the key eSIM technologies, Senior Analyst Karan Dasaor said, “The eSIM enablement space continues to hum with activity, with an array of companies offering eSIM solutions for diverse applications. These companies fall into three broad categories: 1) eUICC OS embedded in a hardware-based tamper-proof MFF2 or Wafer Level Chip Scale Packaging (WLCSP), miniaturized leadless package form-factors soldered into the PCBs; 2) Software-based eUICC in TEE (Trusted Execution Environment), sometimes called as soft-SIM or virtual SIM; 3) The relatively newer space of integrated UICCs, also called iSIM or iUICC, where the iUICC OS is integrated into a secure enclave within the System-on-Chip (SoC).” “As it stands, only the hardware-based MFF2 and WLCSP form-factors are compliant with the security standards defined in GSMA’s SGPv.01/02/21/22 specs. Vendors engaged in supplying these chips are required to be GSMA SAS-UP (Security Accreditation Scheme for UICC Production) certified. Non-compliant proprietary software-based eSIM solutions (mostly iSIM and soft-SIM) are available from various ecosystem players, including component vendors, device manufacturers and operators. The iSIM is seeing a rising adoption, particularly in IoT applications, and is being evaluated to make it a part of GSMA specifications in future. On the other hand, the soft-SIM has seen greater adoption in markets such as China, within smartphones for international roaming services monetization by OEMs, and in IoT applications which are not that security-sensitive.” Counterpoint has used its proprietary CORE (COmpetitive Ranking and Evaluation) framework to help the industry better understand and identify key players driving the thriving eSIM ecosystem. The deep-dive analysis and evaluation focuses on the relevant capabilities based on several interviews with different players. It showcases their strengths, ecosystem reach and several other criteria. Companies such as Thales, G+D (Giesecke & Devrient), IDEMIA and VALID are the leading hardware-based eSIM enablement players integrating their GSMA-compliant eUICC OS into the MFF2/WLCSP chipsets supplied by the likes of ST Micro, Infineon and NXP. Players such as Truphone, Kigen (Arm spinoff), Oasis and RedteaMobile have also partnered with chipset players, module vendors, device OEMs and MNOs to offer eSIM and iSIM solutions expanding the supplier landscape.Exhibit 1: eSIM Enablement CORE Scorecard and Analysis for Integrated Players
Source: eSIM Ecosystem - Opportunities, Trends, Evaluation, Analysis and Outlook, December 2020
Exhibit 2: eSIM Enablement Scorecard Evaluation and Analysis for eSIM Hardware Enablement
Source: eSIM Ecosystem - Opportunities, Trends, Evaluation, Analysis and Outlook, December 2020
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Counterpoint Research is a global industry and market research firm providing market data, intelligence, thought leadership and consulting across the technology ecosystem. We advise a diverse range of global clients spanning the supply chain – from chipmakers, component suppliers, manufacturers and software and application developers to service providers, channel players and investors. Our veteran team of analysts serve these clients through our offices located across the key innovation hubs, manufacturing clusters and commercial centers globally. Our analysts consistently engage with C-suite through to strategy, market intelligence, supply chain, R&D, product management, marketing, sales and others across the organization. Counterpoint’s key coverage areas: AI, Automotive, Cloud, Connectivity, Consumer Electronics, Displays, eSIM, IoT, Location Platforms, Macroeconomics, Manufacturing, Networks & Infra, Semiconductors, Smartphones and Wearables.