Memory Solutions for Gen AI Part 2: Competitive Dynamics in HBM
Overview: This second report in the Memory Solutions for Generative AI series examines the competitive landscape of memory technology, focusing on the competitive landscape.
Table of Contents:
- Samsung's Saga around HBM
- Strategies of SK Hynix and Micron
- Samsung's comeback
- China HBM
Published Date: January 2025
[Correction] In the original report (published Jan. 3, 2025), out of the statement "Micron's delayed introduction of HBM until 2025 is due to its support of a similar high-bandwidth memory called 3D Cube", 2025 should be corrected to 2024. As disclosed in Micron's earnings announcement, Micron started selling HBM3e 8-high in Q3 2024 and are gearing up for a major ramp in 2025.
Category
Industry
AI, Semiconductors
Service
Standard
Report Type
Report
Time Period
Other
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Author
MS Hwang
MS Hwang is a research director at Counterpoint, specializing in memory semiconductor research. MS Hwang brings over 30 years of experience from Samsung Electronics and sell-side brokerage research roles including ABN AMRO, Goldman Sachs, Credit Suisse and Samsung Securities.