Apple 'Arms' Macs with Apple Silicon
- Reducing reliance on a single supplier
- Differentiating products from competitors
- Gaining control of the ecosystem
- Allowing developers to develop apps for both mobile and computer applications using the same APIs and programming tools.
- Reducing cost
Apple’s revenue breakdown from 2007 to 2019
- PCB components will be more compact in future laptop Macs, including MacBook Air and MacBook Pro. This will allow the new Macs to use the up-to-date high-performance processors and other components in a smaller package, leaving more room for battery packs.
- New Macs may adopt BGA-SSD or even raw NAND that will be managed directly by Apple Silicon. This can save some space and costs of controllers.
- Since the ARM core will consume less power, it will not require a large fan as in Intel-based Macs. The saved space will be used for the battery as well.
- The functions of Macbook Air and iPad Pro will become very close. The former is like a clamshell laptop and the latter is like a detachable laptop.
- Future Macs are expected to integrate more sensors, such as 3D sensing and ultra-wideband (UWB). The SoC here will incorporate more powerful NPUs to process the image captured by iPhone 12 and iPad Pro.
- Although the cost of Apple Silicon is lower than Intel's CPU, the price of future Macs will not necessarily be cheaper than the current models. On the other hand, the price may increase because of the new design with additional sensors and chips.
- TSMC: 5nm will be the mainstream technology of Apple Silicon in the next two to three years. In addition to Apple, it is expected to see other SoC vendors working on ARM-based SoC for PC, which will become the next battlefield in the foundry industry.
- ARM: ARM will benefit from the license fee that Apple will pay to migrate its platform.
- Intel: Intel will suffer revenue loss from the transition. However, its impact will be limited. Intel is expected to move to 10nm/7nm soon to stop the increasing adoption of ARM-based SoC in PC.
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Brady Wang
Hi, I’m Brady Wang, a seasoned professional with over 20 years of experience in the high-tech industry, spanning semiconductor manufacturing, market intelligence, and strategic advisory roles. Currently, I serve as an analyst at Counterpoint Research, where I specialize in semiconductors with a focus on advanced applications such as automotive, server platforms, and cutting-edge process nodes. My core research centers on AI servers and their key components, including GPUs, custom accelerators, high-bandwidth memory (HBM), CPUs, and advanced packaging technologies. I also track the evolution of AI server architectures, interconnect technologies, and data center deployment trends. By combining deep technical knowledge with market insight, I help clients navigate the fast-changing AI infrastructure landscape and make strategic, data-driven decisions.