Insight

The $Trillion Bottleneck: Intel Bets EMIB, ZAM and XBM Against TSMC’s CoWoS

AI accelerator shipments will drive advanced packaging demand at scale: over 130 million GPUs/AI ASICs are expected to ship with advanced-packaged on-compute memory over the next five years, generating almost $2 Trillion in compute revenue.

This report provides a comprehensive view of the Cloud AI Server market, covering market outlook and ecosystem developments across CPUs, GPUs and custom AI ASICs. It also examines hyperscaler investment trends, rack-scale systems, advanced packaging, HBM and key supply-chain constraints shaping AI infrastructure growth.