Overview

The Global Automotive NAD Module & Chipset Tracker provides quarterly insights into the automotive connectivity market, tracking module and chipset shipments, ASPs and revenues. It covers vendor performance, chipset models, connectivity technologies and regional trends to help assess market dynamics and technology adoption across automotive connectivity.


What the Full Report Will Cover

The tracker covers 15+ NAD module vendors, including Rolling Wireless, LG Innotek, Quectel, Fibocom, Continental and Harman. On the chipset side, it tracks 10+ chipset vendors and 45+ chipset models, including Qualcomm, MediaTek, Samsung, HiSilicon and UNISOC, with model-level analysis and design-win tracking.

Technology coverage includes 2G, 3G, 4G (Cat 1, Cat 1 bis and Cat 4), 5G, 5G RedCap, NB-IoT, LTE-M, LPWA Dual-Mode and satellite NTN-enabled automotive connectivity.

Regional analysis spans China, North America, Europe, the Middle East and Africa, Latin America, India and Rest of World. The tracker provides historical data from Q1 2023 to Q2 2026.


Who Should Read This

  • Automotive OEMs 
  • Automotive NAD module and chipset vendors
  • Semiconductor suppliers and technology partners


Key Questions the Report Answers

  • Which NAD module and chipset vendors lead the market by shipments, revenue and ASP?
  • Which chipset models are gaining traction across automotive programs?
  • How is the market transitioning from 4G to 5G and 5G RedCap?
  • Which regions and vehicle segments are driving growth?
  • How are OEM sourcing strategies and geopolitical developments reshaping the market?