Overview

This report provides a comprehensive view of the Cloud AI compute market, covering CPUs, GPUs and custom AI ASICs across major vendors and hyperscalers. It tracks shipment trends, revenue, ASP and chip value, alongside CSP CapEx and XPU BOM analysis, providing insight into how AI infrastructure investment and compute architectures are evolving.

What the Full Report Will Cover

• Cloud AI CPU market – Shipments, revenue, ASP, architecture, packaging and memory across merchant and custom CPUs
• Cloud AI GPU market – Vendor and product-level shipment trends, chip value, packaging and memory
• Custom AI ASIC market – Hyperscaler AI accelerator shipments and technology roadmaps
• Hyperscaler/CSP CapEx – Investment trends across major US hyperscalers and Chinese CSPs
• XPU BOM analysis – Key components and cost structure of AI compute platforms
• Market data and forecasts – Historical and forecast shipment, revenue and CapEx data through 2031

Who Should Read This

The report is designed for semiconductor companies, hyperscalers/CSPs, server OEM/ODMs, foundries, packaging and memory suppliers, component vendors, investors and technology strategy teams seeking to understand the evolution of Cloud AI compute and the competitive landscape across CPUs, GPUs and custom ASICs.

Key Questions the Report Answers

• How will Cloud AI CPU, GPU and custom ASIC shipments evolve?
• How is the competitive landscape changing across major AI compute vendors and hyperscalers?
• How are merchant CPUs and hyperscaler custom CPUs evolving?
• How are GPU and custom AI ASIC product roadmaps shaping future compute demand?
• What roles do packaging and memory technologies play across different AI compute platforms?
• How are hyperscaler and CSP CapEx trends shaping Cloud AI infrastructure investment?
• How are shipment volumes, ASPs, chip values and revenues expected to evolve across the Cloud AI compute ecosystem?

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