vious generation's single SoC designs. The SLPs will seriously help curb the space demands in a 5G smartphone. Zhen Ding Technology, Unimicron Technology and Compeq Manufacturing are the PCB manufacturing companies capable of manufacturing SLPs and are companies to keep an eye on. We believe with the advent of 5G, Samsung should adopt SLPs too which could slightly bump up the BoM","isAccessibleForFree":"False","hasPart":{"@type":"WebPageElement","isAccessibleForFree":"False","cssSelector":".paywall"}}1d:T5bc,

"Huawei is looking to follow Apple in adopting SLP PCBs manufactured based on mSAP (modified Semi-Additive Process) for its upcoming flagships starting in 2H 2019. The obvious benefits are board space savings, better electrical performance and energy saving. For Huawei's relentless focus on differentiating with superior battery life (packing in larger batteries) but with thinner designs, this is a natural move. This also nicely aligns with the addition of 5G capabilities later this year, as 5G will expand RF content footprint within phones with additional baseband chips and RF components contrary to previous generation's single SoC designs. The SLPs will seriously help curb the space demands in a 5G smartphone. Zhen Ding Technology, Unimicron Technology and Compeq Manufacturing are the PCB manufacturing companies capable of manufacturing SLPs and are companies to keep an eye on. We believe with the advent of 5G, Samsung should adopt SLPs too which could slightly bump up the BoM contribution from PCBs." - Neil Shah

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